Design Checklist for PCB Assembly

With this design checklist for electronics manufacturing (PCB assembly), we give you a detailed list of what information is necessary for us to assemble your PCBs.

It is already important in the development phase to create the prerequisites to be able to manufacture the assemblies in series as cost-effectively, quickly and with the lowest possible susceptibility to errors. Optimal data means smooth and fast order preparation for us in the event of an order.

Items that are absolutely necessary are highlighted in red. Make sure that these requirements are met, and the data is provided.

Important but not essential items are highlighted in yellow. If this information is missing, order processing will be delayed.

Optional, desirable items are grayed out. By providing this information, you are helping us a great deal.

Assembly Drawings and CAD

1: Assembly drawings as PDF vector file.
2: Assembly drawing for bottom (solder side) mirrored so it's readable.
3: Drill holes and vias visible in assembly drawings.
4: Component polarity of all polarized components clearly and unambiguously marked in assembly drawings. Pin 1, or the cathode, is marked with the exception of tantalum capacitors where the anode is marked.
5: CAD data (Eagle, Altium, etc.) and schematics.
6: 3D views of top and bottom as PDF.

Bill of Materials (BOM)

7: Bill of materials in Excel format.
8: Clear manufacturer and manufacturer items listed for all parts.
9: Strict manufacturer part binding marked (YES/NO).
10: Alternative components specified for each manufacturer binding.
11: Ceramic chip capacitors (MLCC) and thick film chip resistors without manufacturer binding.
12: Component layers listed individually in a table cell ("R1, R2, R3" instead of "R1-R3").
13: Non-populated component locations marked as Do Not Populate "DNP".
14: Customer provided parts clearly identified.
15: Customer item numbers specified for customer provided parts.

Pick-and-Place Files

16: Pick-and-place as a CSV file with metric coordinates (mm).
17: Pick-and-place including non-populated components (DNP).
18: Pick-and-place including fiducials.
19: Non-placed components (DNP) clearly marked in pick-and-place.

Printed Circuit Board (PCB) Data

20: Gerber data for single PCB in RS-274X extended Gerber format. All Gerber data with view from top (bottom side not mirrored).
21: Drill files in XNC format (IPC-NC-349).
22: PCB Specification e.g. FR4, 1.6mm, Ni/Au, 35µm, solder mask green, silk screen white (also if provided by customer).
23: PCB in panel with 10mm surrounding frame or no SMD components closer to the board edge than 10mm.
24: If PCB provided: Paste data for the PCB panel from the PCB manufacturer. Ideally, the full "Working Gerber" data.
25: 3 fiducials present on each SMD assembled side and clear of solder mask. Minimum distance from board edge 7 mm.
26: Panel design by Newmatik or according to specification for optimum panel design for SMD-assembled PCBs.
27: Following design rules for low-cost PCB fabrication whenever possible.

General

28: Part number of assembly and revision clearly indicated and matching in purchase order and customer data.
29: Information regarding the required IPC-610-A class for electronics manufacturing (standard is class 2).

In case of Version Changes

30: Information on what changed compared to previous versions clearly visible in bill of materials.
31: Information whether BOM change or also PCB layout change in Gerber data.