Rework Services

There are a number of reasons why PCB rework may be required. An error during the design process, faulty assembly, or a defective component can cause the PCB to fail.

Thanks to our many years of experience in SMD rework, we can accurately and reliably rework SMD-assembled PCBs, chip resistors, connectors and sockets, as well as BGA, CSP and QFN components. Dedicated rework stations and properly trained personnel ensure that rework is successful.

We perform rework services according to the client's specifications. It is possible to rework assemblies (desoldering, correct component soldering), or to desolder components for further use from already assembled assemblies.

Rework of assemblies

When the goal is to eliminate errors on assemblies to be able to rework them.

The scope of services includes:

1. determination of a soldering profile for rework of components.
2. covering THT components that may be damaged by the heat process.
3. desoldering of the components (infrared bottom heating, hot air top heating).
4. cleaning of the contact surfaces on the printed circuit board.
5. soldering of the new components according to the specified soldering profile.
6. packaging in ESD-compatible shipping packaging.

Unless the following items are explicitly listed in the quotation, the following is NOT included in the scope of services:

1. cleaning the PCB after rework.
2. soldering and desoldering, or disassembly of other components which are damaged by temperature during the rework process against expectation and where a mere covering is not sufficient.
3. x-ray examination before or after rework.
4. electrical function test.
5. circuit diagram analysis.
6. examination of the printed circuit board (micrographs, layer thicknesses, etc.).

Desoldering of components

If the goal is to reuse components that are already assembled for other products.

The scope of services includes:

1. determination of a soldering profile for desoldering the components.
2. desoldering of the components (infrared bottom heating, hot air top heating).
3. cleaning of contact surfaces on the components (only limited possible).
4. reballing of BGA (if applicable).
5. packaging of components in customer provided bars or trays.
6. return of assemblies in the same form as delivered.

Unless the following items are explicitly listed in the quote, the scope of services does NOT include:

1. cleaning of the PCB after rework.
2. cleaning of the solder pads of the desoldered component on the PCB.

Sample fee

In order to determine the feasibility and complexity of the rework and to be able to finally submit a binding offer to our customers, we offer the rework of a sample quantity at a sample fee of €600,00. Based on this, a binding offer is then prepared. Our customers can examine the quality of the rework on the basis of the samples and finally approve it.

Disclaimer

Since irreparable damage to assemblies or components can occur during rework despite professional procedures, we exclude liability for the function of the assemblies and components. Material or financial damages resulting from damaged assemblies and components during rework will not be borne by ESO. This also and in particular applies to the costs of the assembled printed circuit board and components.

It is expressly agreed that the operating and business risk of the assembly and components remains with the client, as well as the user of the PCB. ESO does not assume any responsibility or liability for the operation of the PCB and components in the intended original environment, or for their final use. Any malfunction caused by the PCB or the components is also excluded from liability.

Since only the customer can decide on the intended use, he is responsible for the function test and the release of the PCB, as well as the components in the intended environment. The customer is also responsible for a possible stress test as well as for the subsequent series release.